What is it?

Next-Gen Edge AI with the High Performance OSM-MTK520 rugged computer on module, 2x Arm Cortex A78 and 6x Arm Cortex A55 at 45x45mm and under 10g weight

Accelerate edge AI deployments with the ADLINK OSM-MTK520 OSM R1.2 Size-L module featuring the advanced MediaTek Genio 520 series processor. Equipped with a dual-core Arm Cortex-A78 and a hexa-core Cortex-A55 , it boasts an impressive MediaTek 8th Gen NPU engine capable of up to 10 TOPS , making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption in ultra compact footprint (45x45mm) at under 10g weight.

It addresses Time-to-Market and Scalability Challenges for Next-Gen Drone Startups.

Who is using it?

How is it making an Impact?

The ADLINK OSM-MTK520 is transforming drone development by packing high-performance AI and low-power efficiency into a solderable, credit-card-sized Open Standard Module (OSM). Powered by the MediaTek Genio 520, it provides the dedicated NPU necessary for real-time edge processing, enabling autonomous flight, obstacle avoidance, and sophisticated object recognition without relying on cloud connectivity. Its rugged, LGA package design eliminates the need for bulky connectors, significantly reducing weight and increasing vibration resistance—critical factors for UAV durability. By adhering to SGET OSM standards, it allows developers to scale designs rapidly, ensuring that next-generation drones are more compact, intelligent, and resilient.